GYEON Q2M Compound+ 120 ml.

Our Price:$14.99
Sale Price:$14.24 - You Save:  $0.75 (5%)
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Availability:Usually ships the same business day

Item Description:

Increased cutting power.

Designed to remove heavy defects.

Perfect for dual action and rotary polishers.

Compatible with foam, microfiber, and wool pads.

Q²M Compound+ is a heavy cutting paste that delivers an improved level of scratch removal and high abrasion with a low level of dust and limited secondary defects. Although it does leave light holograms, they are simple to remove with one pass of Q²M Polish.

High Cutting Power And Glossy Finish

Q²M Compound+ delivers increased cutting power without the usual price of enormous defects. The formula is water-based and contains high-quality Japanese abrasives that allow fast and easy removal of harsh defects. No silicone or fillers make the procedure of pre-coating preparation and polish removal much faster and easier.

Advice On Application And Precautions

Work with a polishing machine of your choice (rotary, dual-action or orbital with forced rotation). Spread at low revs. Work until fully diminished at medium revs. Wipe off with an HQ microfiber cloth. Use a 1:1 dilution of IPA to remove the remaining product and inspect the effect. If needed, re-use.

120 ml.

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1 Review
Designed specifically for long-throw dual action polishers. The dual-density design provides optimum surface contact and withstands extended usage on long-stroke machines.


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