Description
Q²M Compound+ is a heavy cutting paste that delivers an improved level of scratch removal and high abrasion with a low level of dust and limited secondary defects. Although it does leave light holograms, they are simple to remove with one pass of Q²M Polish.
High Cutting Power And Glossy Finish
Q²M Compound+ delivers increased cutting power without the usual price of enormous defects. The formula is water-based and contains high-quality Japanese abrasives that allow fast and easy removal of harsh defects. No silicone or fillers make the procedure of pre-coating preparation and polish removal much faster and easier.
Advice On Application And Precautions
Work with a polishing machine of your choice (rotary, dual-action or orbital with forced rotation). Spread at low revs. Work until fully diminished at medium revs. Wipe off with an HQ microfiber cloth. Use a 1:1 dilution of IPA to remove the remaining product and inspect the effect. If needed, re-use.
120 ml.
Additional Information
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seo-heading1: |
Increased cutting power. |
seo-heading2: |
Designed to remove heavy defects. |
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Perfect for dual action and rotary polishers. |
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Compatible with foam,microfiber,and wool pads. |
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package: |
120 ml. |
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ysw-page-title: |
GYEON Q2M Compound+ 120 ml. |
ysw-meta-description: |
GYEON Q2M Compound 120 ml. - QM Compound+ is a heavy cutting paste that delivers an improved level of scratch removal and high abrasion with a low level of dust and limited secondary defects. Although it does leave light holograms,they are simple t. |
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