Less dense foam formula for the application of cleaner waxes and light polishes. This pad has very light cutting power so itís perfect for the removal of light defects and micro marring. Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS technology solves this common problem using strategic patterns of partially closed foam cells. Available on our Standard Duty Orbital (SDO) pads, giving the operator the same consistent performance of the SDO pads, with the added benefit of CCS technology.
We recommend using this pad with a 3 inch backing plate.