GYEON Q2M Compound+ 1000 ml.

Item Description:

Increased cutting power.

Designed to remove heavy defects.

Perfect for dual action and rotary polishers.

Compatible with foam, microfiber, and wool pads.

QM Compound+ is a heavy cutting paste that delivers an improved level of scratch removal and high abrasion with a low level of dust and limited secondary defects. Although it does leave light holograms, they are simple to remove with one pass of QM Polish.

High Cutting Power And Glossy Finish

QM Compound+ delivers increased cutting power without the usual price of enormous defects. The formula is water-based and contains high-quality Japanese abrasives that allow fast and easy removal of harsh defects. No silicone or fillers make the procedure of pre-coating preparation and polish removal much faster and easier.

Advice On Application And Precautions

Work with a polishing machine of your choice (rotary, dual-action or orbital with forced rotation). Spread at low revs. Work until fully diminished at medium revs. Wipe off with an HQ microfiber cloth. Use a 1:1 dilution of IPA to remove the remaining product and inspect the effect. If needed, re-use.

1000 ml.

People who purchased this product also bought:

Designed specifically for long-throw dual action polishers. The dual-density design provides optimum surface contact and withstands extended usage on long-stroke machines.


Top